Aerosense Inc. has chosen to use Mitsui Chemicals’ unique metal resin integral technology, ‘Polymetac,’ in the frames of its new autonomous unmanned aerial vehicles (UAV).
Polymetac is Mitsui Chemicals’ completely new technology for strong adhesion and bonding of various metals and resins that was not possible using conventional methods.
“Polymetac allows adhesion and bonding of various metals and resins, and for the current project, CFRP and aluminum parts were integrated by its technology,” says Akio Hirahara, General Manager of Mitsui Chemicals’ New Market Development (Automotive Materials) Division.
Mitsui Chemicals provides Aerosense with a hybrid product of carbon fiber reinforced plastic (CFRP) and aluminum joint parts made by its Polymetac technology. It also provides full support in shaping and designing parts that will be used in the aerial vehicle’s frame.
The new joint parts greatly enhance the structural rigidity of aerial vehicles while significantly reducing weight. Moreover, they provide simpler designs by eliminating the need for fasteners such as bolts. This in turn reduces the overall weight and number of parts, resulting in greater flight distances and improved performance.
Mitsui Chemicals used its cutting edge simulation technology to design simple joint shapes with a single part that were originally composed of approximately 20 pieces. The technology contributes to a 50% weight reduction of joint parts while improving rigidity.
Hisashi Taniguchi, CEO of Aerosense said that the Polymetac technology makes it possible to extend flight distances by 40%.
Mitsui Chemicals will continue to pursue new uses and development of Polymetac technology for state-of-the-art lightweight solutions in automotive and electrical applications.
Aerosense is a joint venture of Sony Mobile Communications Inc. and ZMP Inc., announced in July 2015. The collaboration will leverage Sony’s camera, sensing, telecommunications network, and robotics technologies alongside ZMP’s automated driving and robotics technologies together with their business experience in industrial fields.
These assets will be combined to develop comprehensive solutions that meet needs like measuring, surveying, observing, and inspecting. The company aims to roll out these services for enterprise customers beginning in 2016.
The joint venture also represents a part of Sony’s push into IoT, as it strives to provide its customers with additional value by developing and managing total package cloud solutions.
Image courtesy of Sony Mobile Communications Inc.