Mitsubishi Heavy Industries Machine Tool introduced its ABLASER-DUV micromachining laser that uses short pulse deep ultraviolet (DUV) laser. With its optimally designed optical system, it provides a smaller focal spot diameter while maintaining a long depth of focus. This enables finer and higher-precision micromachining and drilling.
This micromachining laser is ideal for drilling conically tapered holes and drum-shaped holes, as well as micro-precision machining of difficult-to-cut, hard or brittle materials.
The picosecond class DUV laser has a shorter wavelength than the short pulse YAG or green lasers commonly used in micromachining systems. The smaller focal spot diameter allows finer machining, improving the minimum machining diameter to 10 micrometer (micro: 10-6). The ABLASER-DUV micromachining laser features a near-perfect circular focus spot allowing an outstanding level of precision in-hole machining.
With a large photon energy of a DUV laser this system delivers high machining performance with materials such as glass and compound semiconductors that are hard to process.
Mitsubishi Heavy Industries Machine Tool Co. Ltd.
16-5 Konan 2-chome, Minato-ku,